Hbeonlabs Technologies Private Limited

Infrastructure & Manufacturing Facilities

HBeonLabs Technologies is an Indian technology company specializing in embedded systems, Internet of Things (IoT), and various other technology solutions. Below is an overview of HBeonLabs Technologies, their offerings, and key aspects of their business:

• Founded: The company was established to provide innovative solutions in the fields of embedded systems, IoT, and software development.
• Location: HBeonLabs Technologies is based in India, with its primary operations and development center located in Noida.

• Design and Development: Providing end-to-end embedded system design services, from concept to deployment.
• Firmware Development: Creating firmware for various embedded devices and microcontrollers.
• Custom Hardware: Designing custom hardware solutions tailored to specific client needs.

• IoT Solutions: Offering comprehensive IoT solutions including device design, connectivity, and data management.
• Smart Devices: Developing smart devices for home automation, industrial automation, and other applications.
• IoT Platforms: Building and integrating IoT platforms for data collection, analysis, and management.

• Web and Mobile Applications: Developing custom web and mobile applications to complement embedded and IoT solutions.
• Cloud Integration: Integrating cloud services with IoT and embedded systems for enhanced functionality and scalability.
• Machine Learning and AI: Implementing machine learning and AI algorithms in embedded and IoT applications for smart decision-making.

• Technical Training: Offering training programs on embedded systems, IoT, and related technologies for students and professionals.
• Consultancy Services: Providing consultancy services to help businesses leverage technology for growth and efficiency.

• Microcontrollers and Processors: Expertise in various microcontrollers and processors including ARM, PIC, and AVR.
• Communication Protocols: Proficiency in communication protocols like Bluetooth, Zigbee, Wi-Fi, and LoRa.
• Development Platforms: Utilizing platforms such as Arduino, Raspberry Pi, and custom boards for development.
• Software Tools: Using software tools like Keil, MPLAB, and other IDEs for firmware development.

• Industrial Automation: Solutions for automating industrial processes, improving efficiency, and reducing operational costs.
• Home Automation: Smart home devices and systems for enhanced comfort, security, and energy management.
• Health Monitoring: IoT-based health monitoring systems for real-time patient data tracking and analysis.
• Custom Projects: Tailoring solutions to meet specific customer requirements across various industries.

• Academic Collaborations: Partnering with educational institutions to provide training and development programs.
• Industry Partnerships: Collaborating with other technology companies to co-develop solutions and expand service offerings.

Our Machinery

Yamaha SMT (Surface Mount Technology) machines are known for their high precision, reliability, and efficiency in the electronics manufacturing industry. They are used for placing surface mount components onto printed circuit boards (PCBs). Yamaha offers a range of SMT machines, including high-speed chip shooters, flexible mounters, and multi-functional placement machines. Here's a detailed overview of Yamaha SMT machines:

• High-Speed Placement: Advanced models offer high-speed component placement, essential for mass production.
• Precision and Accuracy: Equipped with high-precision vision systems for accurate component placement.
• Versatility: Capable of handling a wide variety of components, from tiny 0201 packages to large connectors.
• Flexibility: Suitable for both high-volume and small-batch production, as well as quick changeovers.

• YS12F: Known for high-speed and high-precision placement, suitable for a wide range of components.
• YS24: Offers even higher speed and throughput, ideal for large-scale production.

• YSM10: High-speed modular mounter with flexible configuration options.
• YSM20R: Features a high-speed head with an impressive placement rate, suitable for diverse applications.

• Sigma G5S: High-speed modular mounter with dual-lane capability for increased throughput.

• Placement Rate: Can range from tens of thousands to hundreds of thousands of components per hour, depending on the model.
• Component Range: Capable of placing a wide variety of components, from 0201 microchips to large ICs and connectors.

• Vision System: High-resolution cameras for component recognition and placement accuracy.
• Inspection: Some models include in-line inspection capabilities for real-time quality control.

• Types of Feeders: Electric and mechanical feeders, including tape, tray, and stick feeders.
• Feeder Capacity: High feeder capacity allows for extended production runs without frequent reloading.

• Automation: Reduces manual intervention, increasing production efficiency and consistency.
• High Throughput: Capable of handling large production volumes with minimal downtime.

• Quick Changeover: Allows for rapid switching between different production jobs.
• Modular Design: Enables easy upgrades and customization to meet specific production requirements.

• Accurate Placement: High-precision placement ensures reliable solder joints and reduced defects.
• Durability: Built to withstand the rigors of continuous production environments.

• Consumer Electronics: Manufacturing of smartphones, tablets, and other consumer devices.
• Automotive Electronics: Production of electronic components for automotive applications.
• Industrial Electronics: Assembly of PCBs for industrial control systems and machinery.
• Medical Devices: High-precision placement for medical electronics requiring strict quality standards.

Research & Development

Research and Development (R&D) play a crucial role in the advancement of technologies and products, especially in fields like electronics and manufacturing. A well-equipped R&D lab is essential for innovation, testing, and development of new products and solutions. Here’s an overview of a typical R&D setup for an electronics lab, focusing on the tools, equipment, and environment needed:

• Benches and Workstations: Sturdy benches with ESD (Electrostatic Discharge) protection.
• Lighting: Bright, adjustable lighting to minimize eye strain.
• Storage: Cabinets and shelves for storing components, tools, and documentation.

• ESD Protection: ESD mats, wrist straps, and grounding points to protect sensitive components.
• Ventilation: Proper ventilation systems, especially when working with soldering and chemicals.
• Fire Safety: Fire extinguishers, smoke detectors, and first aid kits.

• Soldering Stations: High-quality soldering irons with temperature control.
• Desoldering Tools: Solder suckers, desoldering braid, and hot air rework stations.
• Reflow Oven: For surface mount device (SMD) soldering, like the Vitronics XPM2 mentioned earlier.

• Multimeters: Digital multimeters for measuring voltage, current, and resistance.
• Oscilloscopes: For analyzing signal waveforms and diagnosing circuit issues.
• Signal Generators: For generating electrical signals to test circuits.
• Logic Analyzers: For debugging digital circuits.

• Bench Power Supplies: Variable DC power supplies to provide power to prototypes and test circuits.
• Battery Emulators: For testing battery-powered devices without actual batteries.

• PCB Milling Machine: For quickly fabricating prototype PCBs in-house.
• 3D Printer: For creating enclosures and custom components.

• Pick-and-Place Machine: For placing SMT components onto PCBs (for more advanced labs).
• Manual Tools: Tweezers, cutters, pliers, and screwdrivers for manual assembly and adjustments.

• CAD Software: Tools like Eagle, KiCad, or Altium Designer for PCB design.
• Simulation Software: SPICE or other simulation tools for circuit analysis.

• IDE and Compilers: Integrated development environments for firmware and software development.
• Debuggers and Programmers: JTAG/SWD debuggers for microcontroller programming and debugging.

• Lab Notebook: For documenting experiments, results, and observations.
• Cameras: For capturing images of prototypes and test setups.

• Whiteboards and Pinboards: For brainstorming and planning.
• Software Tools: Version control systems (e.g., Git), project management tools (e.g., Jira, Trello).

• Component Libraries: A collection of commonly used electronic components.
• Datasheets and Manuals: Easily accessible documentation for components and equipment.

• Technical Books: On electronics, embedded systems, and related fields.
• Online Resources: Access to online courses, forums, and industry publications.

Customization Facilities

Customizing a printed circuit board (PCB) of a product involves several steps, from design to manufacturing. Here's an overview of the process:

• CAD Tools: Use software like Eagle, KiCad, Altium Designer, or PCBWay.

• Component Selection: Choose electronic components based on your project's requirements.
• Drawing the Schematic: Connect the components logically using the software.

• Board Outline: Define the shape and size of your PCB.
• Component Placement: Place components on the board considering factors like signal integrity and thermal management.
• Routing: Connect the components with traces, paying attention to guidelines for trace width and spacing.

• Electrical Rule Check (ERC): Ensure all electrical connections are correct.
• Design Rule Check (DRC): Verify that the PCB layout adheres to manufacturing constraints.
• Simulation: Run simulations to check the circuit behavior under different conditions.

• Fabrication Files: Generate Gerber files, Bill of Materials (BOM), and pick-and-place files.
• Prototype Manufacturing: Send the files to a PCB manufacturer for prototyping.

• Soldering: Place and solder components onto the PCB. This can be done manually or using automated equipment.
• Testing: Test the assembled PCB for functionality and performance.

• Review and Revise: Based on testing results, make necessary changes to the design.
• Repeat: Iterate the design and testing process until the PCB meets all requirements.

• Mass Production: Once the design is finalized, order larger quantities from the manufacturer.
• Quality Control: Implement quality control measures to ensure consistency in the production batches.

• Material Selection: Choose the right materials for the PCB substrate and copper thickness.
• Layer Count: Decide on the number of layers based on complexity and signal requirements.
• Thermal Management: Incorporate heat sinks, thermal vias, and other cooling techniques if necessary.
• Signal Integrity: Pay attention to high-speed signal routing and impedance control.
• Compliance and Standards: Ensure the design complies with relevant standards and regulations (e.g., IPC, RoHS).

Manufacturing Facilities

Surface Mount Technology (SMT) infrastructure is essential for modern electronics manufacturing, allowing for the efficient and precise placement of electronic components onto printed circuit boards (PCBs). Establishing an SMT production line requires several key pieces of equipment, each playing a vital role in the process. Below is a detailed overview of the necessary infrastructure and equipment for SMT:

• Function: Applies solder paste to the PCB pads where components will be placed.
• Types: Manual, semi-automatic, and fully automatic stencil printers.
• Key Features: High precision, adjustable printing speed, and alignment systems.

• Function: Places SMT components onto the PCB.
• Types: Entry-level for low-volume production, high-speed machines for mass production.
• Key Features: Component feeders, vision systems for alignment, and high-speed placement.

• Function: Melts the solder paste to create strong, reliable solder joints between components and PCB pads.
• Types: Infrared, convection, and vapor phase reflow ovens.
• Key Features: Multiple heating zones, controlled temperature profiles, and cooling zones.

• Function: Inspects the solder paste deposition for volume, height, and area coverage.
• Importance: Ensures the quality of solder paste application, preventing defects.

• Function: Inspects the PCB for placement accuracy, solder joints, and other defects.
• Key Features: High-resolution cameras, advanced image processing, and defect classification.

• Function: Non-destructive inspection of solder joints, especially useful for BGAs and other hidden joints.
• Key Features: High-resolution imaging, real-time inspection, and 3D imaging capabilities.

• Function: Automates the handling of PCBs at the start and end of the production line.
• Key Features: Conveyor systems, stackers, and magazines.

• Importance: Maintain consistent temperature and humidity levels to ensure the quality of solder paste and prevent defects.
• Components: HVAC systems, humidity controllers, and cleanroom environments.

• Function: Tests the electrical performance of the assembled PCB.
• Key Features: Fixture-based testing, functional test capabilities, and fault diagnosis.

• Function: Ensures the final product operates correctly under real-world conditions.
• Importance: Customized test setups to simulate the operational environment of the product.

• Function: Tracks and manages the production process, from material handling to final product.
• Key Features: Real-time monitoring, traceability, and quality control.

• Importance: Integrates production data with enterprise resource planning for better resource management and planning.

• Importance: High-quality solder paste is crucial for reliable solder joints.
• Types: Leaded and lead-free, various flux compositions.

• Variety: Resistors, capacitors, ICs, LEDs, and other surface-mount components.

Customized Packaging

Customized packaging is a key aspect of branding and customer experience. It involves designing and producing packaging that reflects your brand identity, protects the product, and meets customer expectations. Here’s a guide on how to create customized packaging:

• Size and Shape: Measure the dimensions of your product to determine the packaging size.
• Protection Requirements: Consider the fragility and storage needs of your product.

• Brand Identity: Incorporate your logo, brand colors, and design elements.
• Target Audience: Design packaging that appeals to your customer base.

• Boxes: Cardboard or corrugated boxes for general use.
• Bags: Plastic, paper, or fabric bags for flexible packaging.
• Pouches: Resealable or vacuum-sealed pouches for food or small items.
• Tubes: Cylindrical containers for cosmetics or delicate items.
• Custom Shapes: Unique packaging shapes tailored to your product.

• Cardboard: Lightweight and recyclable, ideal for boxes.
• Plastic: Durable and versatile, used for various packaging types.
• Glass: Premium feel, often used for cosmetics or food.
• Metal: Strong and protective, used for high-end or fragile items.
• Sustainable Materials: Biodegradable or recycled materials for eco-friendly packaging.

• Sketching and Prototyping: Start with sketches and create prototypes.
• Graphic Design: Use software like Adobe Illustrator or Canva to design graphics.
• Die Lines and Templates: Obtain die lines from your packaging supplier for accurate design placement.

• Branding: Prominent display of logo and brand elements.
• Color Scheme: Consistent with brand colors.
• Typography: Clear and readable fonts.
• Imagery: High-quality images that represent your product.
• Information: Include product details, usage instructions, and legal requirements.

• Offset Printing: High-quality and cost-effective for large quantities.
• Digital Printing: Suitable for small runs and personalized packaging.
• Flexography: Common for printing on flexible packaging materials.
• Screen Printing: Ideal for simple designs and smaller quantities.

• Glossy or Matte Finish: Enhances the look and feel of the packaging.
• Embossing/Debossing: Adds texture and a premium feel.
• Foil Stamping: Adds metallic details for a luxurious touch.
• UV Coating: Provides extra protection and a shiny finish.

• Sample Production: Create a few samples to check the design and functionality.
• Feedback: Gather feedback from stakeholders or focus groups.

• Durability Tests: Ensure the packaging can withstand handling and shipping.
• Compliance: Verify that the packaging meets legal and industry standards.

• Order in Bulk: Work with a reliable packaging manufacturer for large orders.
• Lead Times: Plan ahead to accommodate production and shipping times.

• Inspection: Regularly inspect samples from the production line.
• Consistency: Ensure color consistency and print quality across all units.

Manufacturing Unit

The Vitronics Soltec XPM2 reflow oven is a widely used piece of equipment in the electronics manufacturing industry, particularly for surface mount technology (SMT) assembly. It is known for its reliability, precise control over the reflow soldering process, and suitability for a wide range of production volumes. Here's a detailed overview of the Vitronics XPM2 reflow oven:

• High Throughput: Designed for high-volume production with consistent performance.
• Precise Temperature Control: Multiple heating zones with independent temperature control for precise thermal profiling.
• Flexible Configuration: Available in various conveyor lengths and heating zone configurations to meet different production needs.
• Energy Efficiency: Features energy-saving designs and technologies to reduce power consumption.
• User-Friendly Interface: Equipped with an intuitive touchscreen interface for easy operation and monitoring.

• Number of Zones: 10 heating zones (both top and bottom), allowing for detailed thermal profiling.
• Zone Control: Each zone can be independently controlled to achieve the desired temperature profile.

• Number of Cooling Zones: Usually includes 1 to 3 cooling zones to gradually reduce the temperature of the PCB and components after reflow.

• Conveyor Width: Adjustable to accommodate different PCB sizes.
• Conveyor Speed: Variable speed control to match the specific thermal profile requirements.

• Heating Range: Capable of reaching temperatures up to 300°C (572°F) or more, suitable for both leaded and lead-free soldering processes.

• Stable Operation: Ensures consistent reflow soldering results across multiple production runs.
• Profile Flexibility: Capable of handling complex thermal profiles for various types of PCBs and components.

• Insulation and Heat Management: Designed to minimize heat loss and optimize energy usage.
• Power Management: Features to reduce power consumption during idle periods.

• Control System: Advanced control systems with real-time monitoring and adjustments.
• Maintenance: Designed for easy access and maintenance, reducing downtime.

• Consumer Electronics: Suitable for high-volume production of consumer electronic devices.
• Automotive Electronics: Used in the manufacturing of electronic components for automotive applications, requiring high reliability.
• Industrial Equipment: Ideal for producing PCBs for industrial machinery and equipment.
• Medical Devices: Ensures the precise and reliable soldering required for medical electronics.

• Profile Setup: Creating and storing multiple thermal profiles for different products.
• Calibration: Regular calibration of temperature sensors and control systems to maintain accuracy.

• Cleaning: Regular cleaning of heating zones, conveyors, and cooling zones to prevent contamination and ensure efficient heat transfer.
• Inspection: Periodic inspection of all mechanical and electrical components to detect and address any wear or issues.

Our Infrastructure

HBeonLabs Technologies Pvt. Ltd. is an Embedded Hardware and Software Design and Manufacturing Company based out of Greater Noida, Delhi NCR and also Known as reliable manufacturer and suppliers, an ISO 9001: 2015 Certified Company, established in the year 2008, is engaged in offering a qualitative array of customized Embedded and IoT Products. We have built strong expertise in the domains of Wireless & Wired IoT Devices, Medical Electronics, Industrial Automation, and Defense Electronics & Consumer Electronics. HBeonlabs consistently goes beyond its clients’ expectations by clubbing together technology, talent, innovation and the highest quality standards.